Burr-Brown's Analog Front End greatly reduces the size and cost of an HDSL or MDSL system by providing all of the active analog circuitry needed to connect PairGain Technologies SPAROW HDSL digital signal processor to an external compromise hybrid and a 1:2 HDSL line transformer.
All internal filter responses as well as the pulse former output scale with clock frequency-allowing the AFE1104 to operate over a range of bit rates from 196kbps to 1.168Mbps. Functionally, this unit is separated into a transmit and a receive section. The transmit section generates, filters, and buffers outgoing 2B1Q data. The receive section filters and digitizes the symbol data received on the telephone line and passes it to the SPAROW. The HDSL Analog Interface is a monolithic device fabricated on 0.6mCMOS. It operates on a single +5V supply. It is housed in a 48-pin SSOP package.
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` COMPLETE ANALOG INTERFACE` T1, E1, AND MDSL OPERATION` CLOCK SCALEABLE SPEED` SINGLE CHIP SOLUTION` +5V ONLY (5V OR 3.3V DIGITAL)` 250mW POWER DISSIPATION` 48-PIN SSOP` 40°C TO +85°C OPERATION
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Analog Inputs: Current .......................................... ±100mA, Momentary
±10mA, Continuous Voltage ......................... AGND 0.3V to AVDD +0.3V
Analog Outputs Short Circuit to Ground (+25°C) ................. Continuous
AVDD to AGND ....................................................................... 0.3V to 6V
PVDD to PGND ....................................................................... 0.3V to 6V
DVDD to DGND ...................................................................... 0.3V to 6V
PLLIN or PLLOUT to PGND ....................................... 0.3V to PVDD +0.3V
Digital Input Voltage to DGND ................................. 0.3V to DVDD +0.3V
Digital Output Voltage to DGND .............................. 0.3V to DVDD +0.3V
AGND, DGND, PGND Differential Voltage ......................................... 0.3V
Junction Temperature (TJ) ............................................................ +150°C
Storage Temperature Range .......................................... 40°C to +125°C
Lead Temperature (soldering, 3s) ................................................. +260°C
Power Dissipation ......................................................................... 700mW
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Required Field 
